Technical Information

Surface finish:

    Minimum of 100 micro inches of gold

DIE ATTACHMENT:

A) Eutectics

AuSn (80/20), melting point at 280°C

AuGe (88/12), melting point at 356°C

B) Conductive Epoxy

https://www.henkel-adhesives.com/us/en/product/electrically-conductive-adhesives/loctite_ablestik84-1lminb.html

https://www.henkel-adhesives.com/us/en/product/die-attach-adhesives/loctite_ablestikqmi529ht-lv.html

The other conductive epoxy is a Dupont 5504 silver filled or similar

C) Sn62 Solder

The Sn62 melting point is 179°C

Note: SLCC will withstand 400°C. The temperature ramps up should not exceed 4°C/Second.

WIRE BONDING:

Thermo compression, Thermosonic and Wedge bonding

Thermo compression, Thermosonic and Wedge bonding


Thermosonic100°C to 150°CAU
Ultrasonic25°CAU
Thermocompression280°C to 500°CAU


Note: Use .0007″ to .001″ diameter gold wire. 

Handling, Storage and Shelf-Life of Ceramic Capacitors:

Temperature (10°C to 35°C)
Relative Humidity (40% to 60%)